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The latest, most popular and comprehensive intelligent business display product news information is presented for you
Release time:2023-03-23
COB的英文为chip-on-board,意思是板上芯片封装。在进行这种产品工艺时,首先要在基底表面用导热环氧树脂覆盖硅片安放点,然后将硅片安放在基底表面,经热处理后,使硅片牢固地固定在基底上,随后在硅片和基底之间建立电气连接,从而完成工艺。
COB没有了支架的概念,也没有电镀、回流焊和贴片,因此工序去繁从简,效率也得到了提高。
COB全彩没有了支架,视角更大,并且光斑均匀,亮度较高,混色的效果更好,这些都是SMD全彩无法超越的特点和优势。
SMD是点光源,存在眩光和重影等问题,而COB是集成式封装,是面光源,不仅具有大视角,而且还能减少光折射的损失。
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